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■ What's Electrostatic Chuck?

Be able to adhere a Variety of Materials

Thin Warp Wafer Adhered by E-chuck

■ Definition of Electrostatic Chuck

The electrostatic chuck is a device for generating an attracting force between an electrode and an object at a voltage applied to the electrode.

■ Varieties of Electrostatic Chuck

(1) Coulomb-Fore Electrostatic Chuck

(2) Johnsen-Rahbek Electrostatic Chuck, or JR Electrostatic Chuck

■ Advantages of Coulomb-force E-Chuck

(1) Adsorbing various objects such as：metal conductor, semiconductor, insulator (glass), and porous materials.

(2) Working well in vacuum environment.

(3) Never affect on the backside of object, for example TFT circuit, because electric field does not reach it. Avoid traditional electrostatic side-effect.

(4) Not folder, it’s to use adsorption. The object surface of the uniform force, the object does not produce indentation, scars and so on.

(5) Can support thin thickness of the wafer and re-bending wafer. After adsorption, can enter the processing program.

■ Features of Patent Coulomb-Force E-Chuck

(1) Coulomb-Force Electrostatic Chuck.

(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.

(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode

(4) Apply lowest voltage to keep maximum adhesion force.

(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.

(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.

(7) Work normally in a vacuum environments and general atmospheric environments.

(8) Cab define adhesion area and non-adhesion area. Non-adhesion area can define other functions.

(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.

(10) Can be customized into various sizes and thicknesses for customer's applications.

(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.

(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.

■ Principle of Patent Coulomb-Force E-Chuck

Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.

Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.

Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.