■ Video: Patent Coulomb-Force E-Chuck (Electrostatic Chuck)
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
Thin Warp Wafer Adhered by E-chuck
Patent Coulomb-Force E-Chuck (Same Adhesion in Every Area, Workable in Vacuum)
Adhere Various Materials
Mobile E-Chuck Carrier Thin Wafer Carrier_4,6,8,12-inch: MESC, Mobile ElectroStatic Carrier
Thin Wafer E-Chuck Robot Holder
Thin Wafer E-Chuck Palm Holder: Normal Wafer Handling
E-Chuck Copper Foil Holder
Thin Wafer E-Chuck Palm Holder: Thin Wafer Handling
Micro Die Handling 100μm×200μm E-Chuck
Silicone Rubber Heater
FULL-AUTO Thin Wafer Bonder of Mobile E-Chuck Carrier_4,6,8,12 inch
SEMI-AUTO Thin Wafer Bonding of Mobile E-Chuck Carrier_4,6,8,12-inch
SEMI-AUTO Thin Wafer Debonding of Mobile E-Chuck Carrier_4,6,8,12-inch
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