■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck)
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
Thin Warp Wafer Adhered by E-chuck
■ Operational Environments
(1) Atmospheric Pressure
(2) Vacuum Environment
■ Product Features
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Can define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer's applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.
■ Main Applications
①Thin Wafers, Warp Wafers _4,6,8,12-inch
②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
③3D IC Fabric Package, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC
④Flat Glass
⑤Micro-LED
⑥Soft Copper Foil
⑦Soft Film
⑧Vacuum Lamination for OLED or Touch Panel
⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)
■ Main Products
①Micro Die Handling 100μm×200μm E-Chuck
②(Coreless Move-Free) Thin Wafer Mobile E-Chuck Carrier_4,6,8,12-inch
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
③(Wired) Thin Wafer Robot Holder
④(Cordless) Battery Power Holder
⑤Thin Wafer Palm Holder
⑥Anti-wrinkle Foil Holder
⑦2D Curved Holder
⑧3D Curved Holder
⑨AOI Black Holder
⑩Huge Stitching Holder
⑪Other Custom E-Chucks
Thin Wafer Handling Solutions
■ Comparisons with other suckers
■ Product Videos
Patent Coulomb-Force E-Chuck (Same Adhesion in Every Area, Workable in Vacuum)
Adhere Various Materials
Mobile E-Chuck Carrier Thin Wafer Carrier_4,6,8,12-inch: MESC, Mobile ElectroStatic Carrier
Thin Wafer E-Chuck Robot Holder
Thin Wafer E-Chuck Palm Holder: Normal Wafer Handling
E-Chuck Copper Foil Holder
Thin Wafer E-Chuck Palm Holder: Thin Wafer Handling
Micro Die Handling 100μm×200μm E-Chuck
Silicone Rubber Heater
FULL-AUTO Thin Wafer Bonder of Mobile E-Chuck Carrier_4,6,8,12 inch
SEMI-AUTO Thin Wafer Bonding of Mobile E-Chuck Carrier_4,6,8,12-inch
SEMI-AUTO Thin Wafer Debonding of Mobile E-Chuck Carrier_4,6,8,12-inch
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