■ Move-Free Thin Wafer Mobile E-Chuck Carrier Supporter_4,6,8,12
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.
Developed by advanced technology to enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier. After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
■ Main Applications
①Thin Wafers, Warp Wafers _4,6,8,12-inch
②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
③3D IC Fabric Package, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC
④Flat Glass
⑤Micro-LED
⑥Soft Copper Foil
⑦Soft Film
⑧Vacuum Lamination for OLED or Touch Panel
⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)
■ Thin Wafer Carrier Supporter
1. Developed by special technology to enclose electrical field in the E-Chuck.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, Cordless Move-Free Supporter can move freely even disconnecting the power supply.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable for soft, thin and fragile object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Reinforcement Carrier, Wafer Transfer).
■ Main Products
①Micro Die Handling 100μm×200μm E-Chuck
②(Coreless Move-Free) Thin Wafer Mobile E-Chuck Carrier_4,6,8,12-inch
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
③(Wired) Thin Wafer Robot Holder
④(Cordless) Battery Power Holder
⑤Thin Wafer Palm Holder
⑥Anti-wrinkle Foil Holder
⑦2D Curved Holder
⑧3D Curved Holder
⑨AOI Black Holder
⑩Huge Stitching Holder
⑪Other Custom E-Chucks
Thin Wafer Handling Solutions
■ Comparisons with other suckers
■ Product Videos
Patent Coulomb-Force E-Chuck (Same Adhesion in Every Area, Workable in Vacuum)
Adhere Various Materials
Mobile E-Chuck Carrier Thin Wafer Carrier_4,6,8,12-inch: MESC, Mobile ElectroStatic Carrier
Thin Wafer E-Chuck Robot Holder
Thin Wafer E-Chuck Palm Holder: Normal Wafer Handling
E-Chuck Copper Foil Holder
Thin Wafer E-Chuck Palm Holder: Thin Wafer Handling
Micro Die Handling 100μm×200μm E-Chuck
Silicone Rubber Heater
FULL-AUTO Thin Wafer Bonder of Mobile E-Chuck Carrier_4,6,8,12 inch
SEMI-AUTO Thin Wafer Bonding of Mobile E-Chuck Carrier_4,6,8,12-inch
SEMI-AUTO Thin Wafer Debonding of Mobile E-Chuck Carrier_4,6,8,12-inch
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